(Opto)-electronics optical beds/packages
Mintres has the processes in-house to perform component sub-assembly manufacturing for customers in cleanroom conditions.
The available processes are:
- Die bonders.
- Package bonders
- Vacuum soldering ovens.
Mintres has manufactured optical beds with heatsink for opto-electronic laser systems, AlN substrates with diamond heatspreaders for an extremely high thermal spreading capability at affordable cost, AlN substrates with soldered jumper chips.